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Transfer from 5 inch to 12 inch Semiconductor wafer

High Throughput(Reduce swap-out time)

Servo motors employed to boost high speed & accuracy performance

Precise transfer solution for wafer

Controlled through RS-232C interface

Wafer mapping function, Travelling axis(Belt, Linear type) is available (Optional)

Clean room application

User friendly interface teaching method(Easy-console)

Installed in Semiconductor Fab (Korea, Taiwan, China)

1. Handling Object	ø150mm to ø300mm - WAFER
2. Range of Motion
2.1 Z Axis stroke	300MM
2.2 T Axis range	Min 340º
2.3 Maximum reach distance	487.5~513mm
2.4 Minimum working envelope with wafer	Ø570mm(12inch) Ø600mm(12inch with mapping)
2.5 Robot mounting flange (top or bottom)
2.6 Robot weight	Max 65kgf
3.0 Wafer Check
3.1 Vacuum holding check	Wafer chunk
3.2 Vacuum holding check	Vacuum sensor display
4.End-effector
4.1 Vacuum - suction points	One suction point
4.2 Type	Fork / Tongue available
4.3 Contact type	Non edge contact
4.4 Flatness	0.05mm
4.5 Material	Ceramic
4.6 Payload	< 500g( Included End-Effector) - A arm & B arm
5.0 Repeatability
5.1 Z Axis	±0.05mm
5.2 T Axis	±0.05mm
5.3 R Axis	±0.05mm
6.0 Vacuum setting value
6.1 Setting point with vacuum sensor	50Kpa
7.0 Teaching
7.1 Teaching Pendant	Handheld size, user friendly. Equip with emergency STOP button.	By communication method
7.2 Teaching position	16 Stage position teaching data set.
8.0 Power & Utility
8.1 Power	AC 208V±10% , 50/ 60Hz Combination, Single Phase/ 15A	With travelling axis : 20A
8.2. Vacuum	-80kpa or less
9.0 Interface
9.1 Communication	RS232C
10.0 Optional	Travelling Axis, Mapping Sensor