상세설명
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1. Handling Object | ø150mm to ø200mm Semiconductor wafer | |
2. Range of Motion | ||
2.1 Z Axis stroke | 189~191 mm ( 190 mm ) | |
2.2 T Axis range | Min 340º | |
2.3 Maximum reach distance | 390mm / Max Reach : 445mm | |
2.4 Minimum working envelope with wafer | RØ160 Mapping Type : RØ205 |
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2.5 Robot mounting flange (top or bottom) | According to project required | |
2.6 Robot weight | Max 15kgf | |
3.0 Wafer Check | ||
3.1 Vacuum holding check | Wafer chunk | |
3.2 Vacuum holding check | Vacuum sensor display | |
4.End-effector | ||
4.1 Vacuum - suction points | One suction point | |
4.2 Type | Fork / Tongue / Grip Type available | |
4.3 Contact type | Non edge contact | |
4.4 Flatness | 0.05mm | |
4.5 Material | Al /Ceramic | |
4.6 Payload | < 200g(Included End-Effector) | |
5.0 Repeatability | ||
5.1 Z Axis | ±0.05mm | |
5.2 T Axis | ±0.05mm | |
5.3 R Axis | ±0.05mm | |
6.0 Vacuum setting value | ||
6.1 Setting point with vacuum sensor | 50Kpa | |
7.0 Teaching | ||
7.1 Teaching Pendant | Handheld size, user friendly. Equip with emergency STOP button. | By communication method |
7.2 Teaching position | 16 Stage position teaching data set. | |
8.0 Power & Utility | ||
8.1 Power | 110 or 208V , 50/ 60Hz Combination, Single Phase/ 7A | With travelling axis : 15A |
8.2. Vacuum | -80kpa or less |
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9.0 Interface | ||
9.1 Communication | RS232C |