여기에마켓 제품 :: (주)라온테크

1. FEATURES
- Designed for 200mm and 300mm wafer transfer service.
- Designed for customizable configuration.
- Close loop control of enclosure pressure.
- Field maintenance service available.
- Semi standard compliance.
- Easy leveling and docking for fast preparation.

2. Specification

Item		Specification
# of port		2	3	4
Vacuum robot	Robot reach	MAX. 800mm
	No of blade	2 arm
	Z axis(Stroke)	330mm
	Repeatability	≤±0.1mm
작업속도(WPH)		220	280	350
Load port	FOUP opening time	≤12sec
	Cleanliness	Class 1 @ 0.1㎛
	Option	Mapping, ID Reader, Aligner
Filter efficiency		99.9999%
Filter pressure drop		≤7.6mmAq(at 0.2m/sec)

3. Aligner

Wafer size & type	300mm Notch type			450mm Notch type
Grip type	Passive, Vacuum			Passive, Vacuum
Axis	X, Y, Θ, U			X, Y, Θ, U
Accuracy	Centering(㎛)	±20㎛		Centering(㎛)	±30㎛
	Notch(˚)	±0.1˚		Notch(˚)	±0.1˚
Wafer position detection	Wafer	±5mm(R)		Wafer	±5mm(R)
Repeatability & Throughput	Wafer check & vacuum	<0.1sec	<4.1sec (Align time)	Wafer check & vacuum	<0.1sec	<4.3sec (Align time)
	Wafer rotation-theta	<3.5sec		Wafer rotation-theta	<3.5sec
	Wafer line up(X,Y, Θ)	<0.5sec		Wafer line up(X,Y, Θ)	<0.7sec
이동 후 Chuck 이동	X, Y ORG	<0.7sec		X, Y ORG	<0.7sec
Spin chuck	Peek Ø30 ~ Ø50			Peek Ø30 ~ Ø50
Mechanical interface	Bottom			Bottom