상세설명
| Major Specification |
| ▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound |
| ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil |
| ▶▶ No Resin & No Flash guaranteed |
| ▶▶ No Wire-Sweeping & No Voids guaranteed |
| ▶▶ BGA, QFN/MLF, all I.C & Power Packages |
