상세설명
| Major Specification |
| ▶▶ "Mold Flow" Simulation applied for optimized-balance flow of compound |
| ▶▶ Mismatch & Misalign : Max. 1.5 ~ 2.0 mil |
| ▶▶ No Resin & No Flash guaranteed |
| ▶▶ Wire-Sweeping & Void : Same as Automold |
| ▶▶ Compound Saving : 10 ~ 30% vs. Conv. Mold |
