상세설명
→ Size : 40A to 300A
→ Connections : : WAFER TYPE.
→ Body Material : FC20,SCPH2,SCS13,14,16.
→ Body Rating : KS 10,20K.
→ TRIM MATERIAL : 304,316SS
→ TRIM CHARACTERISTIC : ON/OFF
→ BONNET TYPE : PLAIN.
→ PACKING MATERIAL : TEFLON,GRAPHITE.
→ TEMPERATURE RANGE : -20 - 120C
